Wafer Level Chip Scale Packaging Market

WLCSP (Wafer Level Chip Scale Packaging) is a wafer-level chip packaging method, which is different from the traditional chip packaging method (cutting and packaging, and at least 20% of the original chip volume after packaging). The entire wafer is packaged and tested, and then cut into individual IC particles, so the volume after packaging is equivalent to the original size of the IC die. WLCSP's packaging method not only significantly reduces the size of the memory module, but also meets the high density requirements of portable devices for body space; on the other hand, in terms of performance, it also improves the speed and stability of data transmission.
Wafer Level Chip Scale Packaging Market contains market size and forecasts of Wafer Level Chip Scale Packaging (WLCSP) in global, including the following market information:
Global Wafer Level Chip Scale Packaging (WLCSP) Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wafer Level Chip Scale Packaging (WLCSP) Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Wafer Level Chip Scale Packaging (WLCSP) companies in 2021 (%)
The global Wafer Level Chip Scale Packaging (WLCSP) market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Redistribution Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wafer Level Chip Scale Packaging (WLCSP) include National Semiconductor, TSMC, Semco, Samsung Electronics, Amkor, JCET, ASE, Texas Instruments and PTI, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Wafer Level Chip Scale Packaging (WLCSP) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Level Chip Scale Packaging (WLCSP) Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wafer Level Chip Scale Packaging (WLCSP) Market Segment Percentages, by Type, 2021 (%)
Redistribution
Molded Substrate
Global Wafer Level Chip Scale Packaging (WLCSP) Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wafer Level Chip Scale Packaging (WLCSP) Market Segment Percentages, by Application, 2021 (%)
Bluetooth
WLAN
PMIC/PMU
MOSFET
Camera
Other
Global Wafer Level Chip Scale Packaging (WLCSP) Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wafer Level Chip Scale Packaging (WLCSP) Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Level Chip Scale Packaging (WLCSP) revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wafer Level Chip Scale Packaging (WLCSP) revenues share in global market, 2021 (%)
Key companies Wafer Level Chip Scale Packaging (WLCSP) sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Wafer Level Chip Scale Packaging (WLCSP) sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
National Semiconductor
TSMC
Semco
Samsung Electronics
Amkor
JCET
ASE
Texas Instruments
PTI
Nepes
SPIL
Huatian
Xintec
China Wafer Level CSP
Tianshui Alex Hua Tian Polytron Technologies
Tongfu Microelectronics
Macronix