Wafer Grinding Tapes Market

Wafer Grinding Tapes is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
Wafer Grinding Tapes Market aims to provide a comprehensive presentation of the global market for Wafer Grinding Tapes, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinding Tapes. Wafer Grinding Tapes Market contains market size and forecasts of Wafer Grinding Tapes in global, including the following market information:
Global Wafer Grinding Tapes Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Wafer Grinding Tapes Market Sales, 2018-2023, 2024-2029, (K Sqm)
Global top five Wafer Grinding Tapes companies in 2022 (%)
The global Wafer Grinding Tapes market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
UV Type Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Wafer Grinding Tapes include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology, Force-One Applied Materials and AMC Co, Ltd, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Wafer Grinding Tapes manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Grinding Tapes Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global Wafer Grinding Tapes Market Segment Percentages, by Type, 2022 (%)
UV Type
Non-UV Type
Global Wafer Grinding Tapes Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global Wafer Grinding Tapes Market Segment Percentages, by Application, 2022 (%)
Standard
Standard Thin Die
(S)DBG(GAL)
Bump
Global Wafer Grinding Tapes Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global Wafer Grinding Tapes Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Grinding Tapes revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer Grinding Tapes revenues share in global market, 2022 (%)
Key companies Wafer Grinding Tapes sales in global market, 2018-2023 (Estimated), (K Sqm)
Key companies Wafer Grinding Tapes sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Force-One Applied Materials
AMC Co, Ltd
Pantech Tape Co., Ltd
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer Grinding Tapes, market overview.
Chapter 2: Global Wafer Grinding Tapes market size in revenue and volume.
Chapter 3: Detailed analysis of Wafer Grinding Tapes manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer Grinding Tapes in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wafer Grinding Tapes capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.