Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market

Three-dimensional integrated circuit is a MOS integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically and through-silicon via is a type of via connection used in microchip engineering and manufacturing.
Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market contains market size and forecasts of Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect in Global, including the following market information:
Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Memories Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect include Amkor Technology, Elpida Memory, Intel Corporation, Micron Technology Inc., MonolithIC 3D Inc., Renesas Electronics Corporation, Sony, Samsung Electronics and IBM, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Segment Percentages, by Type, 2021 (%)
Memories
Sensors
LEDs
Others
Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Segment Percentages, by Application, 2021 (%)
Military
Aerospace and Defense
Consumer Electronics
Automotive
Others
Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Amkor Technology
Elpida Memory
Intel Corporation
Micron Technology Inc.
MonolithIC 3D Inc.
Renesas Electronics Corporation
Sony
Samsung Electronics
IBM
Qualcomm
STMicroelectronics
Texas Instruments