Thin Wafers Temporary Bonding Equipment and Materials Market

Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding. Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the ?Magic? material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times.
Thin Wafers Temporary Bonding Equipment and Materials Market contains market size and forecasts of Thin Wafers Temporary Bonding Equipment and Materials in Global, including the following market information:
Global Thin Wafers Temporary Bonding Equipment and Materials Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Thin Wafers Temporary Bonding Equipment and Materials market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Chemical Debonding Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Thin Wafers Temporary Bonding Equipment and Materials include 3M, ABB, Accretech, AGC, AMD, Cabot, Corning, Crystal Solar and Dalsa, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Thin Wafers Temporary Bonding Equipment and Materials companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thin Wafers Temporary Bonding Equipment and Materials Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, by Type, 2021 (%)
Chemical Debonding
Hot Sliding Debonding
Mechanical Debonding
Laser Debonding
Global Thin Wafers Temporary Bonding Equipment and Materials Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, by Application, 2021 (%)
< 100 ?m Wafers
below 40?m Wafers
Global Thin Wafers Temporary Bonding Equipment and Materials Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
3M
ABB
Accretech
AGC
AMD
Cabot
Corning
Crystal Solar
Dalsa
DoubleCheck Semiconductors
1366 Technologies
Ebara
ERS
Hamamatsu
IBM
Intel
LG Innotek
Mitsubishi Electric
Qualcomm
Robert Bosch
Samsung
Sumitomo Chemical