Substrate Bump Inspection System Market

This automated inspection system measures the height, diameter, and flatness of bumps mounted on a substrate with hundreds of gang printings, wafer, and wafer ring at high speed and with high accuracy.
Substrate Bump Inspection System Market contains market size and forecasts of Substrate Bump Inspection System in global, including the following market information:
Global Substrate Bump Inspection System Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global Substrate Bump Inspection System Market Sales, 2018-2023, 2023-2030, (Units)
Global top five Substrate Bump Inspection System companies in 2022 (%)
The global Substrate Bump Inspection System market was valued at US$ million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Fully Automatic Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Substrate Bump Inspection System include INTEKPLUS, Nidec-Read Corporation, TAKAOKA TOKO, TAKANO Co.,Ltd, Genesem, Cyber??Optics Corporation, Confovis, Machine Vision Products and Toray Engineering, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Substrate Bump Inspection System manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Substrate Bump Inspection System Market, by Type, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global Substrate Bump Inspection System Market Segment Percentages, by Type, 2022 (%)
Fully Automatic
Semi Automatic
Global Substrate Bump Inspection System Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global Substrate Bump Inspection System Market Segment Percentages, by Application, 2022 (%)
Tradition Packaging
Advanced Packaging
Global Substrate Bump Inspection System Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global Substrate Bump Inspection System Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Substrate Bump Inspection System revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Substrate Bump Inspection System revenues share in global market, 2022 (%)
Key companies Substrate Bump Inspection System sales in global market, 2018-2023 (Estimated), (Units)
Key companies Substrate Bump Inspection System sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
INTEKPLUS
Nidec-Read Corporation
TAKAOKA TOKO
TAKANO Co.,Ltd
Genesem
Cyber??Optics Corporation
Confovis
Machine Vision Products
Toray Engineering
Cheng Mei Instrument Technology
Synapse Imaging
Lasertec
Camtek
Onto Innovation
Lloyd Doyle