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Download Free sampleThe global High Density Interconnect PCB market was valued at 8021.64 Million USD in 2021 and will grow with a CAGR of 7.64% from 2021 to 2027, based on Research newly published report.
The prime objective of High Density Interconnect PCB Market is to provide the insights on the post COVID-19 impact which will help market players in this field evaluate their business approaches. Also, High Density Interconnect PCB Market covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
A high-density interconnect (HDI) is a fastest growing technology used in the printed circuit board (PCB), which have higher wiring density per unit as compared to the conventional circuit boards. These HDI PCBs have finer lines and spaces ( 100 m), smaller vias ( 150 m), and capture pads ( 400 m). Moreover, HDI PCBs have a relatively higher connection pad density over conventional PCBs that is over 20 pads/cm2. Hence, they are widely adopted in the consumer electronics sector and have a high growth potential in the automotive industry.
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