Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
Plating for Microelectronics Market aims to provide a comprehensive presentation of the global market for Plating for Microelectronics, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Plating for Microelectronics. Plating for Microelectronics Market contains market size and forecasts of Plating for Microelectronics in global, including the following market information:
- Global Plating for Microelectronics Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Plating for Microelectronics market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.
We surveyed the Plating for Microelectronics companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Plating for Microelectronics Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Plating for Microelectronics Market Segment Percentages, by Type, 2022 (%)
- Gold
- Zinc
- Nickel
- Bronze
- Tin
- Copper
- Others
Global Plating for Microelectronics Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Plating for Microelectronics Market Segment Percentages, by Application, 2022 (%)
- MEMS
- PCB
- IC
- Photoelectron
- Others
Global Plating for Microelectronics Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Plating for Microelectronics Market Segment Percentages, By Region and Country, 2022 (%)
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Nordic Countries
- Benelux
- Rest of Europe
- Asia
- China
- Japan
- South Korea
- Southeast Asia
- India
- Rest of Asia
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- Turkey
- Israel
- Saudi Arabia
- UAE
- Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies Plating for Microelectronics revenues in global market, 2018-2023 (estimated), ($ millions)
- Key companies Plating for Microelectronics revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
- DOW
- Mitsubishi Materials Corporation
- Heraeus
- XiLong Scientific
- Atotech
- Yamato Denki
- Meltex
- Ishihara Chemical
- Raschig GmbH
- Japan Pure Chemical
- Coatech
- MAGNETO special anodes
- Vopelius Chemie AG
- Moses Lake Industries
- JCU International
- Outline of Major Chapters:
- Chapter 1: Introduces the definition of Plating for Microelectronics, market overview.
- Chapter 2: Global Plating for Microelectronics market size in revenue.
- Chapter 3: Detailed analysis of Plating for Microelectronics company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
- Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
- Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
- Chapter 6: Sales of Plating for Microelectronics in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
- Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
- Chapter 8: The main points and conclusions of the report.
Industry Market Size
