PCB Heat Sinks Market

The global PCB Heat Sinks market was valued at 363 million in 2024 and is projected to reach US$ 659 million by 2032, at a CAGR of 9.1% during the forecast period.
The heat sink is a cooling method that transfers dissipated heat from PCB components into a cooling medium. Heat sink works on the principle of conduction which states that heat transfers from an area of high thermal resistance to an area of low thermal resistance.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
We have surveyed the PCB Heat Sinks manufacturers, suppliers, distributors, and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks
PCB Heat Sinks Market aims to provide a comprehensive presentation of the global market for PCB Heat Sinks, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding PCB Heat Sinks. PCB Heat Sinks Market contains market size and forecasts of PCB Heat Sinks in global, including the following market information:
Global PCB Heat Sinks market revenue, 2020-2025, 2026-2032, ($ millions)
Global PCB Heat Sinks market sales, 2020-2025, 2026-2032, (K Units)
Global top five PCB Heat Sinks companies in 2024 (%)
Total Market by Segment:
Global PCB Heat Sinks market, by Type, 2020-2025, 2026-2032 ($ millions) & (K Units)
Global PCB Heat Sinks market segment percentages, by Type, 2024 (%)
Aluminum
Copper
Others
Global PCB Heat Sinks market, by Application, 2020-2025, 2026-2032 ($ Millions) & (K Units)
Global PCB Heat Sinks market segment percentages, by Application, 2024 (%)
Processors
Power Components
Others
Global PCB Heat Sinks market, by region and country, 2020-2025, 2026-2032 ($ millions) & (K Units)
Global PCB Heat Sinks market segment percentages, by region and country, 2024 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies PCB Heat Sinks revenues in global market, 2020-2025 (estimated), ($ millions)
Key companies PCB Heat Sinks revenues share in global market, 2024 (%)
Key companies PCB Heat Sinks sales in global market, 2020-2025 (estimated), (K Units)
Key companies PCB Heat Sinks sales share in global market, 2024 (%)
Further, the report presents profiles of competitors in the market, key players include:
Advanced Thermal Solutions
Ohmite
CTS Corporation
Moko Technology
CUI Devices
Boyd
Fischer Elektronik
Broadlake
Pada Engineering
Heatell
Shenzhen Mingsihai
Outline of Major Chapters:
Chapter 1: Introduces the definition of PCB Heat Sinks, market overview.
Chapter 2: Global PCB Heat Sinks market size in revenue and volume.
Chapter 3: Detailed analysis of PCB Heat Sinks manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of PCB Heat Sinks in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global PCB Heat Sinks capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.