High-Speed Board-to-Board Connectors Market

Board-to-board (BTB) connectors are used to connect printed circuit boards (PCB), electronic components that contain a conductive pattern printed on the surface of the insulating base in an accurate and repeatable manner. Each terminal on a BTB connector is connected to a PCB. A BTB connector includes housing and a specific number of terminals. The terminal is made from a conductive material (mostly copper alloy), and plated to improve conductivity and antirust. Terminals transmit the current/signal between PCBs connected by BTB; the housing is made of insulating material (mostly plastic).

High-Speed Board-to-Board Connectors Market aims to provide a comprehensive presentation of the global market for High-Speed Board-to-Board Connectors, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High-Speed Board-to-Board Connectors. High-Speed Board-to-Board Connectors Market contains market size and forecasts of High-Speed Board-to-Board Connectors in global, including the following market information:

Global High-Speed Board-to-Board Connectors Market Revenue, 2018-2023, 2024-2030, ($ millions)

Global High-Speed Board-to-Board Connectors Market Sales, 2018-2023, 2024-2030, (K Units)

Global top five High-Speed Board-to-Board Connectors companies in 2022 (%)

The global High-Speed Board-to-Board Connectors market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

North America, Europe and China are major regions produce Board-to-board Connectors in the world, accounting for more than 66% of the world. APAC dominates the global demand market for Board-to-board Connectors and the trend is anticipated to continue for a foreseeable future. APAC is expected to account for the largest share of the global Board-to-board connector market in 2017. The demand for industrial Internet of Thing is high in the APAC region with special focus on process automation. In countries such as Japan and China where the automobile market has opportunities supported by electric vehicles, the consumption of connectors is high. The APAC region is a huge hub for consumer electronics market which in turn increases the demand for connectors in this region.

We surveyed the High-Speed Board-to-Board Connectors manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global High-Speed Board-to-Board Connectors Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (K Units)

Global High-Speed Board-to-Board Connectors Market Segment Percentages, by Type, 2022 (%)

Below 1.00 mm

1.00 mm-2.00 mm

Above 2.00 mm

Global High-Speed Board-to-Board Connectors Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (K Units)

Global High-Speed Board-to-Board Connectors Market Segment Percentages, by Application, 2022 (%)

Transportation

Consumer Electronics

Communications

Industries

Military

Others

Global High-Speed Board-to-Board Connectors Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (K Units)

Global High-Speed Board-to-Board Connectors Market Segment Percentages, By Region and Country, 2022 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies High-Speed Board-to-Board Connectors revenues in global market, 2018-2023 (Estimated), ($ millions)

Key companies High-Speed Board-to-Board Connectors revenues share in global market, 2022 (%)

Key companies High-Speed Board-to-Board Connectors sales in global market, 2018-2023 (Estimated), (K Units)

Key companies High-Speed Board-to-Board Connectors sales share in global market, 2022 (%)

Further, the report presents profiles of competitors in the market, key players include:

TE Connectivity

Samtec

Amphenol

Molex

Fujitsu

Hirose Electric

JST

Joint Admissions Exercise (JAE)

Delphi

Harting

Foxconn

ERNI Electronics

Kyocera

Yamaichi Electronics

Advanced Interconnect

Unimicron Technology

Outline of Major Chapters:

Chapter 1: Introduces the definition of High-Speed Board-to-Board Connectors, market overview.

Chapter 2: Global High-Speed Board-to-Board Connectors market size in revenue and volume.

Chapter 3: Detailed analysis of High-Speed Board-to-Board Connectors manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6: Sales of High-Speed Board-to-Board Connectors in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Global High-Speed Board-to-Board Connectors capacity by region & country.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 11: The main points and conclusions of the report.