High Density Interconnect PCB Market

A high-density interconnect (HDI) is a fastest growing technology used in the printed circuit board (PCB), which have higher wiring density per unit as compared to the conventional circuit boards. These HDI PCBs have finer lines and spaces ( 100 m), smaller vias ( 150 m), and capture pads ( 400 m). Moreover, HDI PCBs have a relatively higher connection pad density over conventional PCBs that is over 20 pads/cm2. Hence, they are widely adopted in the consumer electronics sector and have a high growth potential in the automotive industry.
High Density Interconnect PCB Market contains market size and forecasts of High Density Interconnect PCB in global, including the following market information:
Global High Density Interconnect PCB Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global High Density Interconnect PCB Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five High Density Interconnect PCB companies in 2021 (%)
The global High Density Interconnect PCB market was valued at 8441 million in 2021 and is projected to reach US$ 13290 million by 2028, at a CAGR of 6.7% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Smartphone & Tablet Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of High Density Interconnect PCB include TTM Technologies (US), PCBCART (China), Millennium Circuits Limited (US), RAYMING (China), Mistral Solutions Pvt. Ltd. (India), SIERRA CIRCUITS INC. (US), Advanced Circuits (US), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) and FINELINE Ltd. (Israel) and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the High Density Interconnect PCB manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global High Density Interconnect PCB Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global High Density Interconnect PCB Market Segment Percentages, by Type, 2021 (%)
Smartphone & Tablet
Laptop & PC
Smart Wearables
Others
Global High Density Interconnect PCB Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global High Density Interconnect PCB Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Military And Defense
Telecom And IT
Automotive
Global High Density Interconnect PCB Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global High Density Interconnect PCB Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies High Density Interconnect PCB revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies High Density Interconnect PCB revenues share in global market, 2021 (%)
Key companies High Density Interconnect PCB sales in global market, 2017-2022 (Estimated), (K Units)
Key companies High Density Interconnect PCB sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
TTM Technologies (US)
PCBCART (China)
Millennium Circuits Limited (US)
RAYMING (China)
Mistral Solutions Pvt. Ltd. (India)
SIERRA CIRCUITS INC. (US)
Advanced Circuits (US)
FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
FINELINE Ltd. (Israel)
Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)