Glass Substrate for Semiconductor Package Market

A New Glass Substrate That Meets The Needs Of The Semiconductor And Mems Packaging (Mounting) Markets Through Featuring A Wide Coefficient Of Thermal Expansion (Cte) Range.It Has Features Such As Cover Glass, Various Optimal Ctes As A Supporting Substrate, And Flatness/Smoothness.It Supports Wafers Approximately ?300Mm In Size To Panels Approximately 500M? In Size.

Glass Substrate for Semiconductor Package Market contains market size and forecasts of Glass Substrate for Semiconductor Package in global, including the following market information:

Global Glass Substrate for Semiconductor Package Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Glass Substrate for Semiconductor Package Market Sales, 2017-2022, 2023-2028, (K Units)

Global top five Glass Substrate for Semiconductor Package companies in 2021 (%)

The global Glass Substrate for Semiconductor Package market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Cover Glass Substrate Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Glass Substrate for Semiconductor Package include AGC, Vitrion, Corning Inc, NQW(Nano Quarz Wafer), Schott AG, Plan Optik AG, Tecnisco, LG Chem and Hoya Corporation and etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Glass Substrate for Semiconductor Package manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Glass Substrate for Semiconductor Package Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Glass Substrate for Semiconductor Package Market Segment Percentages, by Type, 2021 (%)

Cover Glass Substrate

Back Ground Glass Substrate

Supporting Glass Substrate

Global Glass Substrate for Semiconductor Package Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Glass Substrate for Semiconductor Package Market Segment Percentages, by Application, 2021 (%)

Wafer Level Packaging

Panel Level Packaging

Global Glass Substrate for Semiconductor Package Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Glass Substrate for Semiconductor Package Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Glass Substrate for Semiconductor Package revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies Glass Substrate for Semiconductor Package revenues share in global market, 2021 (%)

Key companies Glass Substrate for Semiconductor Package sales in global market, 2017-2022 (Estimated), (K Units)

Key companies Glass Substrate for Semiconductor Package sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

AGC

Vitrion

Corning Inc

NQW(Nano Quarz Wafer)

Schott AG

Plan Optik AG

Tecnisco

LG Chem

Hoya Corporation

Ohara Corporation