Fan-Out Wafer Level Packaging Market

The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used standard Wafer process, need is formed on the sealant panel circuit design. Since the area of the sealing panel is larger than that of the chip, not only can I/O contacts be made into the wafer area by Fan-In method; It can also be Fanned Out on a plastic mold to accommodate more I/O contacts.
Fan-Out Wafer Level Packaging Market contains market size and forecasts of Fan-Out Wafer Level Packaging in Global, including the following market information:
Global Fan-Out Wafer Level Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Fan-Out Wafer Level Packaging market was valued at 1409.5 million in 2021 and is projected to reach US$ 4829.4 million by 2028, at a CAGR of 19.2% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
High Density Fan-Out Package Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Fan-Out Wafer Level Packaging include TSMC, ASE Technology Holding Co., JCET Group, Amkor Technology, Siliconware Technology (SuZhou) Co. and Nepes, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Fan-Out Wafer Level Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fan-Out Wafer Level Packaging Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, by Type, 2021 (%)
High Density Fan-Out Package
Core Fan-Out Package
Global Fan-Out Wafer Level Packaging Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, by Application, 2021 (%)
CMOS Image Sensor
A Wireless Connection
Logic and Memory Integrated Circuits
Mems and Sensors
Analog and Hybrid Integrated Circuits
Others
Global Fan-Out Wafer Level Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fan-Out Wafer Level Packaging revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Fan-Out Wafer Level Packaging revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
TSMC
ASE Technology Holding Co.
JCET Group
Amkor Technology
Siliconware Technology (SuZhou) Co.
Nepes