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Download Free sampleThe global Electronic Potting and Encapsulating market was valued at US$ 1855.8 million in 2022 and is projected to reach US$ 3370.8 million by 2029, at a CAGR of 8.9% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
Electronic Potting and Encapsulating Market aims to provide a comprehensive presentation of the global market for Electronic Potting and Encapsulating, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Potting and Encapsulating. Electronic Potting and Encapsulating Market contains market size and forecasts of Electronic Potting and Encapsulating in global, including the following market information:
Global Electronic Potting and Encapsulating Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
Henkel, Dow Corning and Hitachi Chemical are the top 3 players of Electronic Potting & Encapsulating, with about 50% market shares.
We surveyed the Electronic Potting and Encapsulating companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
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