Electronic Potting and Encapsulating market

Electronic Potting and Encapsulating Market, Global Outlook and Forecast 2023-2029

  • 26 April 2023
  • Semiconductor and Electronics
  • 60 Pages
  • Report code : PMR-7656947

  • 4.7 (158)

Electronic Potting and Encapsulating Market

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The global Electronic Potting and Encapsulating market was valued at US$ 1855.8 million in 2022 and is projected to reach US$ 3370.8 million by 2029, at a CAGR of 8.9% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
Electronic Potting and Encapsulating Market aims to provide a comprehensive presentation of the global market for Electronic Potting and Encapsulating, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Potting and Encapsulating. Electronic Potting and Encapsulating Market contains market size and forecasts of Electronic Potting and Encapsulating in global, including the following market information:
Global Electronic Potting and Encapsulating Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)

Henkel, Dow Corning and Hitachi Chemical are the top 3 players of Electronic Potting & Encapsulating, with about 50% market shares.
We surveyed the Electronic Potting and Encapsulating companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:

Global Electronic Potting and Encapsulating Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Electronic Potting and Encapsulating Market Segment Percentages, by Type, 2022 (%)
  • Epoxy
  • Silicones
  • Polyurethane
  • Ohers
Global Electronic Potting and Encapsulating Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Electronic Potting and Encapsulating Market Segment Percentages, by Application, 2022 (%)
  • Consumer Electronics
  • Automotive
  • Medical
  • Telecommunications
  • Others
Global Electronic Potting and Encapsulating Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Electronic Potting and Encapsulating Market Segment Percentages, By Region and Country, 2022 (%)
  • North America
  • US
  • Canada
  • Mexico
  • Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Russia
  • Nordic Countries
  • Benelux
  • Rest of Europe
  • Asia
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Rest of Asia
  • South America
  • Brazil
  • Argentina
  • Rest of South America
  • Middle East & Africa
  • Turkey
  • Israel
  • Saudi Arabia
  • UAE
  • Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
  • Key companies Electronic Potting and Encapsulating revenues in global market, 2018-2023 (estimated), ($ millions)
  • Key companies Electronic Potting and Encapsulating revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
  • Henkel
  • Dow Corning
  • Hitachi Chemical
  • LORD Corporation
  • Huntsman Corporation
  • ITW Engineered Polymers
  • 3M
  • H.B. Fuller
  • John C. Dolph
  • Master Bond
  • ACC Silicones
  • Epic Resins
  • Plasma Ruggedized Solutions
Outline of Major Chapters:
  • Chapter 1: Introduces the definition of Electronic Potting and Encapsulating, market overview.
  • Chapter 2: Global Electronic Potting and Encapsulating market size in revenue.
  • Chapter 3: Detailed analysis of Electronic Potting and Encapsulating company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6: Sales of Electronic Potting and Encapsulating in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: The main points and conclusions of the report.

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