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Download Free sampleDIP sockets or dual inline package sockets feature two parallel rows of connection pins that connect to a motherboard or a printed circuit board.
DualLine Package Sockets Market contains market size and forecasts of Dual in Line Package Sockets in global, including the following market information:
Global Dual in Line Package Sockets Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Dual in Line Package Sockets Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Dual in Line Package Sockets companies in 2021 (%)
The global Dual in Line Package Sockets market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Open Frame Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Dual in Line Package Sockets include 3M, Aries Electronics, Chupond Precision, Enplas, WinWay, Foxconn Technology, Johnstech, Loranger and Mill-Max, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Dual in Line Package Sockets manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Dual in Line Package Sockets Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Dual in Line Package Sockets Market Segment Percentages, by Type, 2021 (%)
Open Frame
Closed Frame
Global Dual in Line Package Sockets Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Dual in Line Package Sockets Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Automotive
Defense
Medical
Others
Global Dual in Line Package Sockets Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Dual in Line Package Sockets Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Dual in Line Package Sockets revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Dual in Line Package Sockets revenues share in global market, 2021 (%)
Key companies Dual in Line Package Sockets sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Dual in Line Package Sockets sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
3M
Aries Electronics
Chupond Precision
Enplas
WinWay
Foxconn Technology
Johnstech
Loranger
Mill-Max
Molex
Plastronics
Sensata Technologies
TE Connectivity
Yamaichi Electronics
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