Die Bonding Machine Market

Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass
Die Bonding Machine Market contains market size and forecasts of Die Bonding Machine in global, including the following market information:
Global Die Bonding Machine Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Die Bonding Machine Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Die Bonding Machine companies in 2021 (%)
The global Die Bonding Machine market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Fully Automatic Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Die Bonding Machine include Besi, ASM Pacific Technology (ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa, DIAS Automation, Toray Engineering, Panasonic and FASFORD TECHNOLOGY, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Die Bonding Machine manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Die Bonding Machine Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Die Bonding Machine Market Segment Percentages, by Type, 2021 (%)
Fully Automatic
Semi-Automatic
Manual
Global Die Bonding Machine Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Die Bonding Machine Market Segment Percentages, by Application, 2021 (%)
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Global Die Bonding Machine Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Die Bonding Machine Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Die Bonding Machine revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Die Bonding Machine revenues share in global market, 2021 (%)
Key companies Die Bonding Machine sales in global market, 2017-2022 (Estimated), (Units)
Key companies Die Bonding Machine sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Besi
ASM Pacific Technology (ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond