3D Solder Paste Inspection System Market

The global 3D Solder Paste Inspection (SPI) System market was valued at US$ 288.5 million in 2022 and is projected to reach US$ 340.4 million by 2029, at a CAGR of 2.4% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection (SPI), you can reduce the defects related to soldering by a considerable amount.
3D Solder Paste Inspection System Market aims to provide a comprehensive presentation of the global market for 3D Solder Paste Inspection (SPI) System, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D Solder Paste Inspection (SPI) System. 3D Solder Paste Inspection System Market contains market size and forecasts of 3D Solder Paste Inspection (SPI) System in global, including the following market information:
Global 3D Solder Paste Inspection (SPI) System Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global 3D Solder Paste Inspection (SPI) System Market Sales, 2018-2023, 2024-2029, (Units)
Global top five 3D Solder Paste Inspection (SPI) System companies in 2022 (%)
The global Solder Paste Inspection (SPI) System market concentration rate is high and dominated by several players from South Korea, China Taiwan, Japan, United States and Germany. Koh Young, MirTec Ltd, PARMI Corp and Pemtron are from South Korea; Test Research (TRI) and Jet Technology from China Taiwan; CyberOptics Corporation, Caltex Scientific and ASC International from United States; and Viscom AG and Vi TECHNOLOGY from Europe. Koh Young, Test Research (TRI) and Sinic-Tek Vision Technology occupied more than 50% of the global market.
We surveyed the 3D Solder Paste Inspection (SPI) System manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:

• Off-line SPI System
• In-line SPI System

• Automotive Electronics
• Consumer Electronics
• Industrials
• Others

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

• Key companies 3D Solder Paste Inspection (SPI) System revenues in global market, 2018-2023 (Estimated), ($ millions)
• Key companies 3D Solder Paste Inspection (SPI) System revenues share in global market, 2022 (%)
• Key companies 3D Solder Paste Inspection (SPI) System sales in global market, 2018-2023 (Estimated), (Units)
• Key companies 3D Solder Paste Inspection (SPI) System sales share in global market, 2022 (%)

• Koh Young
• CyberOptics Corporation
• Test Research, Inc (TRI)
• MirTec Ltd
• PARMI Corp
• Viscom AG
• ViTrox
• Vi TECHNOLOGY
• Mek (Marantz Electronics)
• Pemtron
• SAKI Corporation
• Nordson YESTECH
• Omron Corporation
• Goepel Electronic
• Machine Vision Products (MVP)
• Caltex Scientific
• ASC International
• Sinic-Tek Vision Technology
• Shenzhen JT Automation Equipment
• Jet Technology

• Chapter 1: Introduces the definition of 3D Solder Paste Inspection (SPI) System, market overview.
• Chapter 2: Global 3D Solder Paste Inspection (SPI) System market size in revenue and volume.
• Chapter 3: Detailed analysis of 3D Solder Paste Inspection (SPI) System manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
• Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
• Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
• Chapter 6: Sales of 3D Solder Paste Inspection (SPI) System in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
• Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
• Chapter 8: Global 3D Solder Paste Inspection (SPI) System capacity by region & country.
• Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
• Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
• Chapter 11: The main points and conclusions of the report.