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Download Free sample3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
3D ICs Market contains market size and forecasts of 3D ICs in Global, including the following market information:
Global 3D ICs Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global 3D ICs market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
3D SiCs Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of 3D ICs include Xilinx, Advanced Semiconductor Engineering (ASE), Samsung, STMicroelectronics, Taiwan Semiconductors Manufacturing (TSMC), Toshiba, EV Group and Tessera, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the 3D ICs companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 3D ICs Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global 3D ICs Market Segment Percentages, by Type, 2021 (%)
3D SiCs
Monolithic 3D ICs
Global 3D ICs Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global 3D ICs Market Segment Percentages, by Application, 2021 (%)
Automotive
Smart Technologies
Robotics
Electronics
Medical
Industrial
Global 3D ICs Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global 3D ICs Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 3D ICs revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies 3D ICs revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Xilinx
Advanced Semiconductor Engineering (ASE)
Samsung
STMicroelectronics
Taiwan Semiconductors Manufacturing (TSMC)
Toshiba
EV Group
Tessera
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