CMP Slurries for Advanced Packaging Market

Global CMP Slurries for Advanced Packaging market was valued at 62.7 million in 2024 and is projected to reach USD 106 million by 2032, at a CAGR of 7.9% during the forecast period.

Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning, and is utilized after every deposition-etch step.

CMP Slurries for Advanced Packaging Market studies the CMP Slurries for semiconductor Advanced Packaging, used in TSV, and Hybrid Bonding, etc.
According to our research, the global semiconductor packaging and testing market size in 2023 was approximately USD 82.6 billion, of which advanced packaging accounts for 48% and traditional packaging accounts for 52%. There are three types of advanced packaging companies, namely OSAT, IDM and Foundry. OSAT is in a dominant position, accounting for about 65% of advanced packaging, IDM accounts for about 22% of advanced packaging, and foundry companies' advanced packaging business accounts for the remaining 13%. It is expected that the proportion of OSAT and foundry companies' advanced packaging business will further increase in the next few years.

We have surveyed the CMP Slurries for Advanced Packaging manufacturers, suppliers, distributors, and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks

CMP Slurries for Advanced Packaging Market aims to provide a comprehensive presentation of the global market for CMP Slurries for Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding CMP Slurries for Advanced Packaging.

CMP Slurries for Advanced Packaging Market contains market size and forecasts of CMP Slurries for Advanced Packaging in global, including the following market information:

• Global CMP Slurries for Advanced Packaging market revenue, 2020-2025, 2026-2032, (D millions)
• Global CMP Slurries for Advanced Packaging market sales, 2020-2025, 2026-2032, (Tons)
• Global top five CMP Slurries for Advanced Packaging companies in 2024 (%)

Total Market by Segment:
Global CMP Slurries for Advanced Packaging market, by Type, 2020-2025, 2026-2032 (D millions) & (Tons)
Global CMP Slurries for Advanced Packaging market segment percentages, by Type, 2024 (%)

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• Cu Barrier & TSV Slurry
• Si and Back Side of TSV Substrate
• Others

Global CMP Slurries for Advanced Packaging market, by Application, 2020-2025, 2026-2032 (D Millions) & (Tons)
Global CMP Slurries for Advanced Packaging market segment percentages, by Application, 2024 (%)

• 3D TSV
• Hybrid Bonding

Global CMP Slurries for Advanced Packaging market, by region and country, 2020-2025, 2026-2032 (D millions) & (Tons)
Global CMP Slurries for Advanced Packaging market segment percentages, by region and country, 2024 (%)

• North America (United States, Canada, Mexico)
• Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
• Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
• The Middle East and Africa (Middle East, Africa)
• South and Central America (Brazil, Argentina, Rest of SCA) 

Competitor Analysis
The report also provides analysis of leading market participants including:

• Key companies CMP Slurries for Advanced Packaging revenues in global market, 2020-2025 (estimated), (D millions)
• Key companies CMP Slurries for Advanced Packaging revenues share in global market, 2024 (%)
• Key companies CMP Slurries for Advanced Packaging sales in global market, 2020-2025 (estimated), (Tons)
• Key companies CMP Slurries for Advanced Packaging sales share in global market, 2024 (%)

Further, the report presents profiles of competitors in the market, key players include:

• DuPont
• Fujifilm
• Fujimi Incorporated
• Resonac
• Anjimirco Shanghai
• Soulbrain
• SKC
• AGC
• Merck (Versum Materials)
• Saint-Gobain
• Dongjin Semichem
• SKC (SK Enpulse)
• TOPPAN INFOMEDIA

Outline of Major Chapters:

• Chapter 1: Introduces the definition of CMP Slurries for Advanced Packaging, market overview.
• Chapter 2: Global CMP Slurries for Advanced Packaging market size in revenue and volume.
• Chapter 3: Detailed analysis of CMP Slurries for Advanced Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
• Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
• Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
• Chapter 6: Sales of CMP Slurries for Advanced Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
• Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
• Chapter 8: Global CMP Slurries for Advanced Packaging capacity by region & country.
• Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
• Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
• Chapter 11: The main points and conclusions of the report.