Automotive Power Module Packaging Market

Technical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN are pushing the development of new power packaging solutions, as these devices can work at higher junction temperatures and higher switching frequencies with smaller die sizes
Automotive Power Module Packaging Market contains market size and forecasts of Automotive Power Module Packaging in Global, including the following market information:
Global Automotive Power Module Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Automotive Power Module Packaging market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Intelligent Power Module Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Automotive Power Module Packaging include Amkor Technology, Kulicke and Soffa Industries, Infineon Technologies, STMicroelectronics, Fuji Electric, Toshiba Electronic Device & Storage Corporation, Semikron, STATS ChipPAC and Starpower Semiconductor, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Automotive Power Module Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Automotive Power Module Packaging Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Automotive Power Module Packaging Market Segment Percentages, by Type, 2021 (%)
Intelligent Power Module
SiC Module
GaN Module
Other
Global Automotive Power Module Packaging Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Automotive Power Module Packaging Market Segment Percentages, by Application, 2021 (%)
Battery Electric Vehicles (BEV)
Plug-in Hybrid Electric Vehicles (PHEV)
Global Automotive Power Module Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Automotive Power Module Packaging Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Automotive Power Module Packaging revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Automotive Power Module Packaging revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Amkor Technology
Kulicke and Soffa Industries
Infineon Technologies
STMicroelectronics
Fuji Electric
Toshiba Electronic Device & Storage Corporation
Semikron
STATS ChipPAC
Starpower Semiconductor
Bosch
Toyota
Mitsubishi