Alumina Multilayered Ceramic Substrates and Packages Market

Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications. For Alumina Multilayered Ceramic Substrates and Packages,due to its multilayered structure, circuit designs can be delivered flexibly through layers and complex structures,e.g. cavity structures, are available.
Alumina Multilayered Ceramic Substrates and Packages Market contains market size and forecasts of Alumina Multilayered Ceramic Substrates and Packages in Global, including the following market information:
Global Alumina Multilayered Ceramic Substrates and Packages Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Alumina Multilayered Ceramic Substrates and Packages market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
White Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Alumina Multilayered Ceramic Substrates and Packages include Kyocera, Maruwa, NEO Tech, AdTech Ceramics, NGK Spark Plug, SCHOTT Electronic Packaging, Ametek, Electronic Products and SoarTech, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Alumina Multilayered Ceramic Substrates and Packages companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Alumina Multilayered Ceramic Substrates and Packages Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Alumina Multilayered Ceramic Substrates and Packages Market Segment Percentages, by Type, 2021 (%)
White
Brown
Global Alumina Multilayered Ceramic Substrates and Packages Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Alumina Multilayered Ceramic Substrates and Packages Market Segment Percentages, by Application, 2021 (%)
Surface-mount Packages
MEMS Packages
Optical Communication Packages
LED Packages
Global Alumina Multilayered Ceramic Substrates and Packages Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Alumina Multilayered Ceramic Substrates and Packages Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Alumina Multilayered Ceramic Substrates and Packages revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Alumina Multilayered Ceramic Substrates and Packages revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Kyocera
Maruwa
NEO Tech
AdTech Ceramics
NGK Spark Plug
SCHOTT Electronic Packaging
Ametek
Electronic Products
SoarTech
ECRI Microelectronics
Jiangsu Yixing Electronics
Chaozhou Three-Circle
Hebei Sinopack Electronic Tech