Wafer-level Packaging Equipment Market

Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.
Wafer-level Packaging Equipment Market contains market size and forecasts of Wafer-level Packaging Equipment in global, including the following market information:
Global Wafer-level Packaging Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wafer-level Packaging Equipment Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Wafer-level Packaging Equipment companies in 2021 (%)
The global Wafer-level Packaging Equipment market was valued at 2676.3 million in 2021 and is projected to reach US$ 4831.3 million by 2028, at a CAGR of 8.8% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Fan In Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wafer-level Packaging Equipment include Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, Tokyo Seimitsu, Disco, SEMES, Suss Microtec and Veeco/CNT and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer-level Packaging Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer-level Packaging Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wafer-level Packaging Equipment Market Segment Percentages, by Type, 2021 (%)
Fan In
Fan Out
Others
Global Wafer-level Packaging Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wafer-level Packaging Equipment Market Segment Percentages, by Application, 2021 (%)
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other
Global Wafer-level Packaging Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wafer-level Packaging Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer-level Packaging Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wafer-level Packaging Equipment revenues share in global market, 2021 (%)
Key companies Wafer-level Packaging Equipment sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Wafer-level Packaging Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Veeco/CNT
Rudolph Technologies