Semiconductor Wafer Slicing Equipment Market

Semiconductor wafer slicing equipment is mainly used in the packaging process. It is a device that divides wafers containing many chips into wafer particles one by one.
Semiconductor Wafer Slicing Equipment Market contains market size and forecasts of Semiconductor Wafer Slicing Equipment in global, including the following market information:
Global Semiconductor Wafer Slicing Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Semiconductor Wafer Slicing Equipment Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Semiconductor Wafer Slicing Equipment companies in 2021 (%)
The global Semiconductor Wafer Slicing Equipment market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Blade Slicing Equipment Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Wafer Slicing Equipment include DISCO, Tokyo Seimitsu, GL Tech, ASM, Synova, CETC Electronics Equipment Group, Hi-TESI, Tensun and Shenyang Heyan Technology and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We has surveyed the Semiconductor Wafer Slicing Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Wafer Slicing Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Semiconductor Wafer Slicing Equipment Market Segment Percentages, by Type, 2021 (%)
Blade Slicing Equipment
Laser Slicing Equipment
Global Semiconductor Wafer Slicing Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Semiconductor Wafer Slicing Equipment Market Segment Percentages, by Application, 2021 (%)
Pure Foundry
IDM
OSAT
LED
Photovoltaic
Others
Global Semiconductor Wafer Slicing Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Semiconductor Wafer Slicing Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Wafer Slicing Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Semiconductor Wafer Slicing Equipment revenues share in global market, 2021 (%)
Key companies Semiconductor Wafer Slicing Equipment sales in global market, 2017-2022 (Estimated), (Units)
Key companies Semiconductor Wafer Slicing Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
DISCO
Tokyo Seimitsu
GL Tech
ASM
Synova
CETC Electronics Equipment Group
Hi-TESI
Tensun
Shenyang Heyan Technology
Jiangsu Jingchuang Advanced Electronic Technology