Semiconductor Assembly Process Equipment Market

Semiconductor Assembly Process Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
Semiconductor Assembly Process Equipment Market contains market size and forecasts of Semiconductor Assembly Process Equipment in global, including the following market information:
Global Semiconductor Assembly Process Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Semiconductor Assembly Process Equipment Market Sales, 2017-2022, 2023-2028, (Unit)
Global top five Semiconductor Assembly Process Equipment companies in 2021 (%)
The global Semiconductor Assembly Process Equipment market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Die Bonders Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Assembly Process Equipment include ASM Pacific Technology, Kulicke & Soffa Industries, Besi, Accrutech, Shinkawa, Palomar Technologies, Hesse Mechatronics, Toray Engineering and West Bond, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Semiconductor Assembly Process Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Assembly Process Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Unit)
Global Semiconductor Assembly Process Equipment Market Segment Percentages, by Type, 2021 (%)
Die Bonders
Wire Bonders
Packaging Equipment
Others
Global Semiconductor Assembly Process Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Unit)
Global Semiconductor Assembly Process Equipment Market Segment Percentages, by Application, 2021 (%)
IDMs
OSAT
Global Semiconductor Assembly Process Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Unit)
Global Semiconductor Assembly Process Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Assembly Process Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Semiconductor Assembly Process Equipment revenues share in global market, 2021 (%)
Key companies Semiconductor Assembly Process Equipment sales in global market, 2017-2022 (Estimated), (Unit)
Key companies Semiconductor Assembly Process Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASM Pacific Technology
Kulicke & Soffa Industries
Besi
Accrutech
Shinkawa
Palomar Technologies
Hesse Mechatronics
Toray Engineering
West Bond
HYBOND
DIAS Automation