Multichip Package Market

Multichip Package (MCP) defines a packaging option in which multiple die and/or packaged devices (SOICs, CSPs) are incorporated into a single package. The MCP may be considered as an alternative to an Application Specific Integrated Circuit (ASIC). Compared to the ASIC it is a viable option offering lower cost and faster time to market. It presents many advantages providing for a significant increase in packaging efficiency by replacing multiple packages with a single package.

Multichip Package Market contains market size and forecasts of Multichip Package in Global, including the following market information:

• Global Multichip Package Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global top five companies in 2021 (%)
• The global Multichip Package market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
HC or HIC Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Multichip Package include Micron Technology, Texas Instruments, Cypress Semiconductor Corporation, SK Hynix, ASE, Amkor, Intel, Samsung and AT&S, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Multichip Package companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:
Global Multichip Package Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Multichip Package Market Segment Percentages, by Type, 2021 (%)

• HC or HIC
• MCMs
• 3-D Packaging
• SiP or SoP

Global Multichip Package Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Multichip Package Market Segment Percentages, by Application, 2021 (%)

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• Consumer Electronics
• Industrial
• Automotive & Transport
• Aerospace & Defense
• Others

Global Multichip Package Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Multichip Package Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis
The report also provides analysis of leading market participants including:

• Key companies Multichip Package revenues in global market, 2017-2022 (estimated), ($ millions)
• Key companies Multichip Package revenues share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Micron Technology
• Texas Instruments
• Cypress Semiconductor Corporation
• SK Hynix
• ASE
• Amkor
• Intel
• Samsung
• AT&S
• IBM
• UTAC
• TSMC
• Qorvo