List of Chapters/Sections(Table Of Content)
1 Study Coverage
1.1 System-in-Package (SIP) and 3D Packaging Product Introduction
1.2 Market by Type
1.2.1 Global System-in-Package (SIP) and 3D Packaging Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 System-in-Package
1.2.3 3D Packaging
1.3 Market by Application
1.3.1 Global System-in-Package (SIP) and 3D Packaging Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 Wearable Medicine
1.3.3 IT & Telecommunication
1.3.4 Automotive & Transport
1.3.5 Industrial
1.3.6 Other
1.4 Study Objectives
1.5 Years Considered
2 Global System-in-Package (SIP) and 3D Packaging Production
2.1 Global System-in-Package (SIP) and 3D Packaging Production Capacity (2017-2028)
2.2 Global System-in-Package (SIP) and 3D Packaging Production by Region: 2017 VS 2021 VS 2028
2.3 Global System-in-Package (SIP) and 3D Packaging Production by Region
2.3.1 Global System-in-Package (SIP) and 3D Packaging Historic Production by Region (2017-2022)
2.3.2 Global System-in-Package (SIP) and 3D Packaging Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
2.9 Taiwan
3 Global System-in-Package (SIP) and 3D Packaging Sales in Volume & Value Estimates and Forecasts
3.1 Global System-in-Package (SIP) and 3D Packaging Sales Estimates and Forecasts 2017-2028
3.2 Global System-in-Package (SIP) and 3D Packaging Revenue Estimates and Forecasts 2017-2028
3.3 Global System-in-Package (SIP) and 3D Packaging Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global System-in-Package (SIP) and 3D Packaging Sales by Region
3.4.1 Global System-in-Package (SIP) and 3D Packaging Sales by Region (2017-2022)
3.4.2 Global Sales System-in-Package (SIP) and 3D Packaging by Region (2023-2028)
3.5 Global System-in-Package (SIP) and 3D Packaging Revenue by Region
3.5.1 Global System-in-Package (SIP) and 3D Packaging Revenue by Region (2017-2022)
3.5.2 Global System-in-Package (SIP) and 3D Packaging Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global System-in-Package (SIP) and 3D Packaging Production Capacity by Manufacturers
4.2 Global System-in-Package (SIP) and 3D Packaging Sales by Manufacturers
4.2.1 Global System-in-Package (SIP) and 3D Packaging Sales by Manufacturers (2017-2022)
4.2.2 Global System-in-Package (SIP) and 3D Packaging Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of System-in-Package (SIP) and 3D Packaging in 2021
4.3 Global System-in-Package (SIP) and 3D Packaging Revenue by Manufacturers
4.3.1 Global System-in-Package (SIP) and 3D Packaging Revenue by Manufacturers (2017-2022)
4.3.2 Global System-in-Package (SIP) and 3D Packaging Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by System-in-Package (SIP) and 3D Packaging Revenue in 2021
4.4 Global System-in-Package (SIP) and 3D Packaging Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global System-in-Package (SIP) and 3D Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global System-in-Package (SIP) and 3D Packaging Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global System-in-Package (SIP) and 3D Packaging Sales by Type
5.1.1 Global System-in-Package (SIP) and 3D Packaging Historical Sales by Type (2017-2022)
5.1.2 Global System-in-Package (SIP) and 3D Packaging Forecasted Sales by Type (2023-2028)
5.1.3 Global System-in-Package (SIP) and 3D Packaging Sales Market Share by Type (2017-2028)
5.2 Global System-in-Package (SIP) and 3D Packaging Revenue by Type
5.2.1 Global System-in-Package (SIP) and 3D Packaging Historical Revenue by Type (2017-2022)
5.2.2 Global System-in-Package (SIP) and 3D Packaging Forecasted Revenue by Type (2023-2028)
5.2.3 Global System-in-Package (SIP) and 3D Packaging Revenue Market Share by Type (2017-2028)
5.3 Global System-in-Package (SIP) and 3D Packaging Price by Type
5.3.1 Global System-in-Package (SIP) and 3D Packaging Price by Type (2017-2022)
5.3.2 Global System-in-Package (SIP) and 3D Packaging Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global System-in-Package (SIP) and 3D Packaging Sales by Application
6.1.1 Global System-in-Package (SIP) and 3D Packaging Historical Sales by Application (2017-2022)
6.1.2 Global System-in-Package (SIP) and 3D Packaging Forecasted Sales by Application (2023-2028)
6.1.3 Global System-in-Package (SIP) and 3D Packaging Sales Market Share by Application (2017-2028)
6.2 Global System-in-Package (SIP) and 3D Packaging Revenue by Application
6.2.1 Global System-in-Package (SIP) and 3D Packaging Historical Revenue by Application (2017-2022)
6.2.2 Global System-in-Package (SIP) and 3D Packaging Forecasted Revenue by Application (2023-2028)
6.2.3 Global System-in-Package (SIP) and 3D Packaging Revenue Market Share by Application (2017-2028)
6.3 Global System-in-Package (SIP) and 3D Packaging Price by Application
6.3.1 Global System-in-Package (SIP) and 3D Packaging Price by Application (2017-2022)
6.3.2 Global System-in-Package (SIP) and 3D Packaging Price Forecast by Application (2023-2028)
7 North America
7.1 North America System-in-Package (SIP) and 3D Packaging Market Size by Type
7.1.1 North America System-in-Package (SIP) and 3D Packaging Sales by Type (2017-2028)
7.1.2 North America System-in-Package (SIP) and 3D Packaging Revenue by Type (2017-2028)
7.2 North America System-in-Package (SIP) and 3D Packaging Market Size by Application
7.2.1 North America System-in-Package (SIP) and 3D Packaging Sales by Application (2017-2028)
7.2.2 North America System-in-Package (SIP) and 3D Packaging Revenue by Application (2017-2028)
7.3 North America System-in-Package (SIP) and 3D Packaging Sales by Country
7.3.1 North America System-in-Package (SIP) and 3D Packaging Sales by Country (2017-2028)
7.3.2 North America System-in-Package (SIP) and 3D Packaging Revenue by Country (2017-2028)
7.3.3 U.S.
7.3.4 Canada
8 Europe
8.1 Europe System-in-Package (SIP) and 3D Packaging Market Size by Type
8.1.1 Europe System-in-Package (SIP) and 3D Packaging Sales by Type (2017-2028)
8.1.2 Europe System-in-Package (SIP) and 3D Packaging Revenue by Type (2017-2028)
8.2 Europe System-in-Package (SIP) and 3D Packaging Market Size by Application
8.2.1 Europe System-in-Package (SIP) and 3D Packaging Sales by Application (2017-2028)
8.2.2 Europe System-in-Package (SIP) and 3D Packaging Revenue by Application (2017-2028)
8.3 Europe System-in-Package (SIP) and 3D Packaging Sales by Country
8.3.1 Europe System-in-Package (SIP) and 3D Packaging Sales by Country (2017-2028)
8.3.2 Europe System-in-Package (SIP) and 3D Packaging Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific System-in-Package (SIP) and 3D Packaging Market Size by Type
9.1.1 Asia Pacific System-in-Package (SIP) and 3D Packaging Sales by Type (2017-2028)
9.1.2 Asia Pacific System-in-Package (SIP) and 3D Packaging Revenue by Type (2017-2028)
9.2 Asia Pacific System-in-Package (SIP) and 3D Packaging Market Size by Application
9.2.1 Asia Pacific System-in-Package (SIP) and 3D Packaging Sales by Application (2017-2028)
9.2.2 Asia Pacific System-in-Package (SIP) and 3D Packaging Revenue by Application (2017-2028)
9.3 Asia Pacific System-in-Package (SIP) and 3D Packaging Sales by Region
9.3.1 Asia Pacific System-in-Package (SIP) and 3D Packaging Sales by Region (2017-2028)
9.3.2 Asia Pacific System-in-Package (SIP) and 3D Packaging Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
9.3.12 Philippines
10 Latin America
10.1 Latin America System-in-Package (SIP) and 3D Packaging Market Size by Type
10.1.1 Latin America System-in-Package (SIP) and 3D Packaging Sales by Type (2017-2028)
10.1.2 Latin America System-in-Package (SIP) and 3D Packaging Revenue by Type (2017-2028)
10.2 Latin America System-in-Package (SIP) and 3D Packaging Market Size by Application
10.2.1 Latin America System-in-Package (SIP) and 3D Packaging Sales by Application (2017-2028)
10.2.2 Latin America System-in-Package (SIP) and 3D Packaging Revenue by Application (2017-2028)
10.3 Latin America System-in-Package (SIP) and 3D Packaging Sales by Country
10.3.1 Latin America System-in-Package (SIP) and 3D Packaging Sales by Country (2017-2028)
10.3.2 Latin America System-in-Package (SIP) and 3D Packaging Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
11 Middle East and Africa
11.1 Middle East and Africa System-in-Package (SIP) and 3D Packaging Market Size by Type
11.1.1 Middle East and Africa System-in-Package (SIP) and 3D Packaging Sales by Type (2017-2028)
11.1.2 Middle East and Africa System-in-Package (SIP) and 3D Packaging Revenue by Type (2017-2028)
11.2 Middle East and Africa System-in-Package (SIP) and 3D Packaging Market Size by Application
11.2.1 Middle East and Africa System-in-Package (SIP) and 3D Packaging Sales by Application (2017-2028)
11.2.2 Middle East and Africa System-in-Package (SIP) and 3D Packaging Revenue by Application (2017-2028)
11.3 Middle East and Africa System-in-Package (SIP) and 3D Packaging Sales by Country
11.3.1 Middle East and Africa System-in-Package (SIP) and 3D Packaging Sales by Country (2017-2028)
11.3.2 Middle East and Africa System-in-Package (SIP) and 3D Packaging Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 Advanced Micro Devices, Inc.
12.1.1 Advanced Micro Devices, Inc. Corporation Information
12.1.2 Advanced Micro Devices, Inc. Overview
12.1.3 Advanced Micro Devices, Inc. System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 Advanced Micro Devices, Inc. System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Advanced Micro Devices, Inc. Recent Developments
12.2 Amkor Technology
12.2.1 Amkor Technology Corporation Information
12.2.2 Amkor Technology Overview
12.2.3 Amkor Technology System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Amkor Technology System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Amkor Technology Recent Developments
12.3 ASE Group
12.3.1 ASE Group Corporation Information
12.3.2 ASE Group Overview
12.3.3 ASE Group System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 ASE Group System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 ASE Group Recent Developments
12.4 Cisco
12.4.1 Cisco Corporation Information
12.4.2 Cisco Overview
12.4.3 Cisco System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 Cisco System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Cisco Recent Developments
12.5 EV Group
12.5.1 EV Group Corporation Information
12.5.2 EV Group Overview
12.5.3 EV Group System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 EV Group System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 EV Group Recent Developments
12.6 IBM Corporation
12.6.1 IBM Corporation Corporation Information
12.6.2 IBM Corporation Overview
12.6.3 IBM Corporation System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 IBM Corporation System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 IBM Corporation Recent Developments
12.7 Intel
12.7.1 Intel Corporation Information
12.7.2 Intel Overview
12.7.3 Intel System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 Intel System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Intel Recent Developments
12.8 Intel Corporation
12.8.1 Intel Corporation Corporation Information
12.8.2 Intel Corporation Overview
12.8.3 Intel Corporation System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 Intel Corporation System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Intel Corporation Recent Developments
12.9 Jiangsu Changjiang Electronics Technology Co. Ltd.
12.9.1 Jiangsu Changjiang Electronics Technology Co. Ltd. Corporation Information
12.9.2 Jiangsu Changjiang Electronics Technology Co. Ltd. Overview
12.9.3 Jiangsu Changjiang Electronics Technology Co. Ltd. System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 Jiangsu Changjiang Electronics Technology Co. Ltd. System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Jiangsu Changjiang Electronics Technology Co. Ltd. Recent Developments
12.10 On Semiconductor
12.10.1 On Semiconductor Corporation Information
12.10.2 On Semiconductor Overview
12.10.3 On Semiconductor System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 On Semiconductor System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 On Semiconductor Recent Developments
12.11 Qualcomm Technologies Inc.
12.11.1 Qualcomm Technologies Inc. Corporation Information
12.11.2 Qualcomm Technologies Inc. Overview
12.11.3 Qualcomm Technologies Inc. System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.11.4 Qualcomm Technologies Inc. System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 Qualcomm Technologies Inc. Recent Developments
12.12 Rudolph Technology
12.12.1 Rudolph Technology Corporation Information
12.12.2 Rudolph Technology Overview
12.12.3 Rudolph Technology System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.12.4 Rudolph Technology System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 Rudolph Technology Recent Developments
12.13 SAMSUNG Electronics Co. Ltd.
12.13.1 SAMSUNG Electronics Co. Ltd. Corporation Information
12.13.2 SAMSUNG Electronics Co. Ltd. Overview
12.13.3 SAMSUNG Electronics Co. Ltd. System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.13.4 SAMSUNG Electronics Co. Ltd. System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 SAMSUNG Electronics Co. Ltd. Recent Developments
12.14 Siliconware Precision Industries Co., Ltd.
12.14.1 Siliconware Precision Industries Co., Ltd. Corporation Information
12.14.2 Siliconware Precision Industries Co., Ltd. Overview
12.14.3 Siliconware Precision Industries Co., Ltd. System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.14.4 Siliconware Precision Industries Co., Ltd. System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.14.5 Siliconware Precision Industries Co., Ltd. Recent Developments
12.15 Sony Corp
12.15.1 Sony Corp Corporation Information
12.15.2 Sony Corp Overview
12.15.3 Sony Corp System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.15.4 Sony Corp System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.15.5 Sony Corp Recent Developments
12.16 STMicroelectronics
12.16.1 STMicroelectronics Corporation Information
12.16.2 STMicroelectronics Overview
12.16.3 STMicroelectronics System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.16.4 STMicroelectronics System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.16.5 STMicroelectronics Recent Developments
12.17 SUSS Microtek
12.17.1 SUSS Microtek Corporation Information
12.17.2 SUSS Microtek Overview
12.17.3 SUSS Microtek System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.17.4 SUSS Microtek System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.17.5 SUSS Microtek Recent Developments
12.18 Taiwan Semiconductor Manufacturing Company
12.18.1 Taiwan Semiconductor Manufacturing Company Corporation Information
12.18.2 Taiwan Semiconductor Manufacturing Company Overview
12.18.3 Taiwan Semiconductor Manufacturing Company System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.18.4 Taiwan Semiconductor Manufacturing Company System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.18.5 Taiwan Semiconductor Manufacturing Company Recent Developments
12.19 Texas Insruments
12.19.1 Texas Insruments Corporation Information
12.19.2 Texas Insruments Overview
12.19.3 Texas Insruments System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.19.4 Texas Insruments System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.19.5 Texas Insruments Recent Developments
12.20 Tokyo Electron
12.20.1 Tokyo Electron Corporation Information
12.20.2 Tokyo Electron Overview
12.20.3 Tokyo Electron System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.20.4 Tokyo Electron System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.20.5 Tokyo Electron Recent Developments
12.21 ChipMOS Technologies
12.21.1 ChipMOS Technologies Corporation Information
12.21.2 ChipMOS Technologies Overview
12.21.3 ChipMOS Technologies System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.21.4 ChipMOS Technologies System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.21.5 ChipMOS Technologies Recent Developments
12.22 Nanium S.A.
12.22.1 Nanium S.A. Corporation Information
12.22.2 Nanium S.A. Overview
12.22.3 Nanium S.A. System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.22.4 Nanium S.A. System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.22.5 Nanium S.A. Recent Developments
12.23 InsightSiP
12.23.1 InsightSiP Corporation Information
12.23.2 InsightSiP Overview
12.23.3 InsightSiP System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.23.4 InsightSiP System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.23.5 InsightSiP Recent Developments
12.24 Fujitsu
12.24.1 Fujitsu Corporation Information
12.24.2 Fujitsu Overview
12.24.3 Fujitsu System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.24.4 Fujitsu System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.24.5 Fujitsu Recent Developments
12.25 Freescale Semiconductor
12.25.1 Freescale Semiconductor Corporation Information
12.25.2 Freescale Semiconductor Overview
12.25.3 Freescale Semiconductor System-in-Package (SIP) and 3D Packaging Sales, Price, Revenue and Gross Margin (2017-2022)
12.25.4 Freescale Semiconductor System-in-Package (SIP) and 3D Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.25.5 Freescale Semiconductor Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 System-in-Package (SIP) and 3D Packaging Industry Chain Analysis
13.2 System-in-Package (SIP) and 3D Packaging Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 System-in-Package (SIP) and 3D Packaging Production Mode & Process
13.4 System-in-Package (SIP) and 3D Packaging Sales and Marketing
13.4.1 System-in-Package (SIP) and 3D Packaging Sales Channels
13.4.2 System-in-Package (SIP) and 3D Packaging Distributors
13.5 System-in-Package (SIP) and 3D Packaging Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 System-in-Package (SIP) and 3D Packaging Industry Trends
14.2 System-in-Package (SIP) and 3D Packaging Market Drivers
14.3 System-in-Package (SIP) and 3D Packaging Market Challenges
14.4 System-in-Package (SIP) and 3D Packaging Market Restraints
15 Key Finding in The Global System-in-Package (SIP) and 3D Packaging Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
