Chapter/Section Purchase

1 IC Packaging Market Overview
1.1 Product Overview and Scope of IC Packaging
1.2 IC Packaging Segment by Type
1.2.1 Global IC Packaging Market Size Growth Rate Analysis by Type 2021 VS 2027
1.2.2 DIP
1.2.3 SOP
1.2.4 QFP
1.2.5 QFN
1.2.6 BGA
1.2.7 CSP
1.2.8 LGA
1.2.9 WLP
1.2.10 FC
1.2.11 Others
1.3 IC Packaging Segment by Application
1.3.1 Global IC Packaging Consumption Comparison by Application: 2016 VS 2021 VS 2027
1.3.2 CIS
1.3.3 MEMS
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging Revenue Estimates and Forecasts (2016-2027)
1.4.2 Global IC Packaging Production Estimates and Forecasts (2016-2027)
1.5 Global Market Size by Region
1.5.1 Global IC Packaging Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
1.5.2 North America IC Packaging Estimates and Forecasts (2016-2027)
1.5.3 Europe IC Packaging Estimates and Forecasts (2016-2027)
1.5.4 China IC Packaging Estimates and Forecasts (2016-2027)
1.5.5 China Taiwan IC Packaging Estimates and Forecasts (2016-2027)
1.5.6 Japan IC Packaging Estimates and Forecasts (2016-2027)
1.5.7 South Korea IC Packaging Estimates and Forecasts (2016-2027)

2 Market Competition by Manufacturers
2.1 Global IC Packaging Production Market Share by Manufacturers (2016-2021)
2.2 Global IC Packaging Revenue Market Share by Manufacturers (2016-2021)
2.3 IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.4 Global IC Packaging Average Price by Manufacturers (2016-2021)
2.5 Manufacturers IC Packaging Production Sites, Area Served, Product Types
2.6 IC Packaging Market Competitive Situation and Trends
2.6.1 IC Packaging Market Concentration Rate
2.6.2 Global 5 and 10 Largest IC Packaging Players Market Share by Revenue
2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region
3.1 Global Production of IC Packaging Market Share by Region (2016-2021)
3.2 Global IC Packaging Revenue Market Share by Region (2016-2021)
3.3 Global IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.4 North America IC Packaging Production
3.4.1 North America IC Packaging Production Growth Rate (2016-2021)
3.4.2 North America IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.5 Europe IC Packaging Production
3.5.1 Europe IC Packaging Production Growth Rate (2016-2021)
3.5.2 Europe IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.6 China IC Packaging Production
3.6.1 China IC Packaging Production Growth Rate (2016-2021)
3.6.2 China IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.7 China Taiwan IC Packaging Production
3.7.1 China Taiwan IC Packaging Production Growth Rate (2016-2021)
3.7.2 China Taiwan IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.8 Japan IC Packaging Production
3.8.1 Japan IC Packaging Production Growth Rate (2016-2021)
3.8.2 Japan IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.9 South Korea IC Packaging Production
3.9.1 South Korea IC Packaging Production Growth Rate (2016-2021)
3.9.2 South Korea IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)

4 Global IC Packaging Consumption by Region
4.1 Global IC Packaging Consumption by Region
4.1.1 Global IC Packaging Consumption by Region
4.1.2 Global IC Packaging Consumption Market Share by Region
4.2 North America
4.2.1 North America IC Packaging Consumption by Country
4.2.2 U.S.
4.2.3 Canada
4.3 Europe
4.3.1 Europe IC Packaging Consumption by Country
4.3.2 Germany
4.3.3 France
4.3.4 U.K.
4.3.5 Italy
4.3.6 Russia
4.4 Asia Pacific
4.4.1 Asia Pacific IC Packaging Consumption by Region
4.4.2 China
4.4.3 Japan
4.4.4 South Korea
4.4.5 Taiwan
4.4.6 Southeast Asia
4.4.7 India
4.4.8 Australia
4.5 Latin America
4.5.1 Latin America IC Packaging Consumption by Country
4.5.2 Mexico
4.5.3 Brazil

5 Production, Revenue, Price Trend by Type
5.1 Global IC Packaging Production Market Share by Type (2016-2021)
5.2 Global IC Packaging Revenue Market Share by Type (2016-2021)
5.3 Global IC Packaging Price by Type (2016-2021)

6 Consumption Analysis by Application
6.1 Global IC Packaging Consumption Market Share by Application (2016-2021)
6.2 Global IC Packaging Consumption Growth Rate by Application (2016-2021)

7 Key Companies Profiled
7.1 ASE
7.1.1 ASE IC Packaging Corporation Information
7.1.2 ASE IC Packaging Product Portfolio
7.1.3 ASE IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.1.4 ASE Main Business and Markets Served
7.1.5 ASE Recent Developments/Updates
7.2 Amkor
7.2.1 Amkor IC Packaging Corporation Information
7.2.2 Amkor IC Packaging Product Portfolio
7.2.3 Amkor IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.2.4 Amkor Main Business and Markets Served
7.2.5 Amkor Recent Developments/Updates
7.3 SPIL
7.3.1 SPIL IC Packaging Corporation Information
7.3.2 SPIL IC Packaging Product Portfolio
7.3.3 SPIL IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.3.4 SPIL Main Business and Markets Served
7.3.5 SPIL Recent Developments/Updates
7.4 STATS ChipPac
7.4.1 STATS ChipPac IC Packaging Corporation Information
7.4.2 STATS ChipPac IC Packaging Product Portfolio
7.4.3 STATS ChipPac IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.4.4 STATS ChipPac Main Business and Markets Served
7.4.5 STATS ChipPac Recent Developments/Updates
7.5 Powertech Technology
7.5.1 Powertech Technology IC Packaging Corporation Information
7.5.2 Powertech Technology IC Packaging Product Portfolio
7.5.3 Powertech Technology IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.5.4 Powertech Technology Main Business and Markets Served
7.5.5 Powertech Technology Recent Developments/Updates
7.6 J-devices
7.6.1 J-devices IC Packaging Corporation Information
7.6.2 J-devices IC Packaging Product Portfolio
7.6.3 J-devices IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.6.4 J-devices Main Business and Markets Served
7.6.5 J-devices Recent Developments/Updates
7.7 UTAC
7.7.1 UTAC IC Packaging Corporation Information
7.7.2 UTAC IC Packaging Product Portfolio
7.7.3 UTAC IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.7.4 UTAC Main Business and Markets Served
7.7.5 UTAC Recent Developments/Updates
7.8 JECT
7.8.1 JECT IC Packaging Corporation Information
7.8.2 JECT IC Packaging Product Portfolio
7.8.3 JECT IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.8.4 JECT Main Business and Markets Served
7.7.5 JECT Recent Developments/Updates
7.9 ChipMOS
7.9.1 ChipMOS IC Packaging Corporation Information
7.9.2 ChipMOS IC Packaging Product Portfolio
7.9.3 ChipMOS IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.9.4 ChipMOS Main Business and Markets Served
7.9.5 ChipMOS Recent Developments/Updates
7.10 Chipbond
7.10.1 Chipbond IC Packaging Corporation Information
7.10.2 Chipbond IC Packaging Product Portfolio
7.10.3 Chipbond IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.10.4 Chipbond Main Business and Markets Served
7.10.5 Chipbond Recent Developments/Updates
7.11 KYEC
7.11.1 KYEC IC Packaging Corporation Information
7.11.2 KYEC IC Packaging Product Portfolio
7.11.3 KYEC IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.11.4 KYEC Main Business and Markets Served
7.11.5 KYEC Recent Developments/Updates
7.12 STS Semiconductor
7.12.1 STS Semiconductor IC Packaging Corporation Information
7.12.2 STS Semiconductor IC Packaging Product Portfolio
7.12.3 STS Semiconductor IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.12.4 STS Semiconductor Main Business and Markets Served
7.12.5 STS Semiconductor Recent Developments/Updates
7.13 Huatian
7.13.1 Huatian IC Packaging Corporation Information
7.13.2 Huatian IC Packaging Product Portfolio
7.13.3 Huatian IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.13.4 Huatian Main Business and Markets Served
7.13.5 Huatian Recent Developments/Updates
7.14 MPl(Carsem)
7.14.1 MPl(Carsem) IC Packaging Corporation Information
7.14.2 MPl(Carsem) IC Packaging Product Portfolio
7.14.3 MPl(Carsem) IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.14.4 MPl(Carsem) Main Business and Markets Served
7.14.5 MPl(Carsem) Recent Developments/Updates
7.15 Nepes
7.15.1 Nepes IC Packaging Corporation Information
7.15.2 Nepes IC Packaging Product Portfolio
7.15.3 Nepes IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.15.4 Nepes Main Business and Markets Served
7.15.5 Nepes Recent Developments/Updates
7.16 FATC
7.16.1 FATC IC Packaging Corporation Information
7.16.2 FATC IC Packaging Product Portfolio
7.16.3 FATC IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.16.4 FATC Main Business and Markets Served
7.16.5 FATC Recent Developments/Updates
7.17 Walton
7.17.1 Walton IC Packaging Corporation Information
7.17.2 Walton IC Packaging Product Portfolio
7.17.3 Walton IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.17.4 Walton Main Business and Markets Served
7.17.5 Walton Recent Developments/Updates
7.18 Unisem
7.18.1 Unisem IC Packaging Corporation Information
7.18.2 Unisem IC Packaging Product Portfolio
7.18.3 Unisem IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.18.4 Unisem Main Business and Markets Served
7.18.5 Unisem Recent Developments/Updates
7.19 NantongFujitsu Microelectronics
7.19.1 NantongFujitsu Microelectronics IC Packaging Corporation Information
7.19.2 NantongFujitsu Microelectronics IC Packaging Product Portfolio
7.19.3 NantongFujitsu Microelectronics IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.19.4 NantongFujitsu Microelectronics Main Business and Markets Served
7.19.5 NantongFujitsu Microelectronics Recent Developments/Updates
7.20 Hana Micron
7.20.1 Hana Micron IC Packaging Corporation Information
7.20.2 Hana Micron IC Packaging Product Portfolio
7.20.3 Hana Micron IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.20.4 Hana Micron Main Business and Markets Served
7.20.5 Hana Micron Recent Developments/Updates
7.21 Signetics
7.21.1 Signetics IC Packaging Corporation Information
7.21.2 Signetics IC Packaging Product Portfolio
7.21.3 Signetics IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.21.4 Signetics Main Business and Markets Served
7.21.5 Signetics Recent Developments/Updates
7.22 LINGSEN
7.22.1 LINGSEN IC Packaging Corporation Information
7.22.2 LINGSEN IC Packaging Product Portfolio
7.22.3 LINGSEN IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.22.4 LINGSEN Main Business and Markets Served
7.22.5 LINGSEN Recent Developments/Updates

8 IC Packaging Manufacturing Cost Analysis
8.1 IC Packaging Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Raw Materials Price Trend
8.1.3 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of IC Packaging
8.4 IC Packaging Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 IC Packaging Distributors List
9.3 IC Packaging Customers

10 Market Dynamics
10.1 IC Packaging Industry Trends
10.2 IC Packaging Growth Drivers
10.3 IC Packaging Market Challenges
10.4 IC Packaging Market Restraints

11 Production and Supply Forecast
11.1 Global Forecasted Production of IC Packaging by Region (2022-2027)
11.2 North America IC Packaging Production, Revenue Forecast (2022-2027)
11.3 Europe IC Packaging Production, Revenue Forecast (2022-2027)
11.4 China IC Packaging Production, Revenue Forecast (2022-2027)
11.5 China Taiwan IC Packaging Production, Revenue Forecast (2022-2027)
11.6 Japan IC Packaging Production, Revenue Forecast (2022-2027)
11.7 South Korea IC Packaging Production, Revenue Forecast (2022-2027)

12 Consumption and Demand Forecast
12.1 Global Forecasted Demand Analysis of IC Packaging
12.2 North America Forecasted Consumption of IC Packaging by Country
12.3 Europe Market Forecasted Consumption of IC Packaging by Country
12.4 Asia Pacific Market Forecasted Consumption of IC Packaging by Region
12.5 Latin America Forecasted Consumption of IC Packaging by Country

13 Forecast by Type and by Application (2022-2027)
13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
13.1.1 Global Forecasted Production of IC Packaging by Type (2022-2027)
13.1.2 Global Forecasted Revenue of IC Packaging by Type (2022-2027)
13.1.3 Global Forecasted Price of IC Packaging by Type (2022-2027)
13.2 Global Forecasted Consumption of IC Packaging by Application (2022-2027)

14 Research Finding and Conclusion

15 Methodology and Data Source
15.1 Methodology/Research Approach
15.1.1 Research Programs/Design
15.1.2 Market Size Estimation
15.1.3 Market Breakdown and Data Triangulation
15.2 Data Source
15.2.1 Secondary Sources
15.2.2 Primary Sources
15.3 Author List
15.4 Disclaimer