Metal Shell for Microelectronic Packages Market

Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
Traditional metal materials include: Cu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.
Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; ? has good heat conduction and heat dissipation; ? good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; ? Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.
Metal Shell for Microelectronic Packages Market aims to provide a comprehensive presentation of the global market for Metal Shell for Microelectronic Packages, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Metal Shell for Microelectronic Packages. Metal Shell for Microelectronic Packages Market contains market size and forecasts of Metal Shell for Microelectronic Packages in global, including the following market information:
Global Metal Shell for Microelectronic Packages Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Metal Shell for Microelectronic Packages Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Metal Shell for Microelectronic Packages companies in 2022 (%)
The global Metal Shell for Microelectronic Packages market was valued at US$ 2051.9 million in 2022 and is projected to reach US$ 2038.2 million by 2029, at a CAGR of -0.1% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
In terms of market sales, China accounts for 22% of global market share.
In terms of suppliers, the world's leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.
In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.
We surveyed the Metal Shell for Microelectronic Packages manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Metal Shell for Microelectronic Packages Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Metal Shell for Microelectronic Packages Market Segment Percentages, by Type, 2022 (%)
TO Shell
Flat Shell
Global Metal Shell for Microelectronic Packages Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Metal Shell for Microelectronic Packages Market Segment Percentages, by Application, 2022 (%)
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
Global Metal Shell for Microelectronic Packages Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Metal Shell for Microelectronic Packages Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Metal Shell for Microelectronic Packages revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Metal Shell for Microelectronic Packages revenues share in global market, 2022 (%)
Key companies Metal Shell for Microelectronic Packages sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Metal Shell for Microelectronic Packages sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
Outline of Major Chapters:
Chapter 1: Introduces the definition of Metal Shell for Microelectronic Packages, market overview.
Chapter 2: Global Metal Shell for Microelectronic Packages market size in revenue and volume.
Chapter 3: Detailed analysis of Metal Shell for Microelectronic Packages manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Metal Shell for Microelectronic Packages in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Metal Shell for Microelectronic Packages capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.