Epoxy Molding Compound for Semiconductor Market

Epoxy Molding Compound (EMC) for Semiconductor market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Epoxy Molding Compound (EMC) for Semiconductor market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Standard (Halogen Free) Epoxy Molding Compound
Little Warpage Epoxy Molding Compound
High Thermal Epoxy Molding Compound
Segment by Application
Lead Frame (DIS and DIP)
Substrate (BGA and CSP)
Power Devices
By Company
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE