Circuit Board Protection and Encapsulation Adhesive Market

Environmental protection of circuits and individual components is necessary to ensure that device integrity and reliability is maintained throughout the operating life of the electronic device.
Circuit Board Protection and Encapsulation Adhesive Market contains market size and forecasts of Circuit Board Protection and Encapsulation Adhesive in global, including the following market information:
Global Circuit Board Protection and Encapsulation Adhesive Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Circuit Board Protection and Encapsulation Adhesive Market Sales, 2017-2022, 2023-2028, (Kiloton)
Global top five Circuit Board Protection and Encapsulation Adhesive companies in 2021 (%)
The global Circuit Board Protection and Encapsulation Adhesive market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Circuit Board Protection Adhesive Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Circuit Board Protection and Encapsulation Adhesive include Henkel, Dow, H.B. Fuller, Chase Corporation, Dymax Corporation, Cytec Solvay, Electrolube, Chemtronics and MG Chemicals, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Circuit Board Protection and Encapsulation Adhesive manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Circuit Board Protection and Encapsulation Adhesive Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Circuit Board Protection and Encapsulation Adhesive Market Segment Percentages, by Type, 2021 (%)
Circuit Board Protection Adhesive
Circuit Encapsulation Adhesive
Global Circuit Board Protection and Encapsulation Adhesive Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Circuit Board Protection and Encapsulation Adhesive Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Automotive
Aerospace & Defense
Others
Global Circuit Board Protection and Encapsulation Adhesive Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Circuit Board Protection and Encapsulation Adhesive Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Circuit Board Protection and Encapsulation Adhesive revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Circuit Board Protection and Encapsulation Adhesive revenues share in global market, 2021 (%)
Key companies Circuit Board Protection and Encapsulation Adhesive sales in global market, 2017-2022 (Estimated), (Kiloton)
Key companies Circuit Board Protection and Encapsulation Adhesive sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Henkel
Dow
H.B. Fuller
Chase Corporation
Dymax Corporation
Cytec Solvay
Electrolube
Chemtronics
MG Chemicals
Master Bond
Kisco
ABchimie
Nordson ASYMTEK
ACC Silicones
CSL Silicones