Aluminum Bonding Wires Market

Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
Aluminum wire bonding is a process similar to gold wire bonding but with the critical distinction that the surface does not need to be heated to 150?C or even anything above room temperature. Force and ultrasonics are vital to the formation of aluminum bonds. The creation of an aluminum wire bond is the same as for gold wire, which consists of two attachment points and a specific loop shape. During the attachment steps for the wire, the only factors needed for the bond are force and ultrasonics, as the surface does not need to be heated.
Aluminum bonding wire, like gold wire, provides a strong electrical path for connections between components in an assembly but has some key advantages. Aluminum bonding allows for interconnections to be formed on temperature-sensitive assemblies where the materials cannot withstand the temperatures usually required for gold bonding. Aluminum wire is also much preferred over gold wire on Aluminum surfaces in hermetically sealed packages as the temperatures needed for hermetic sealing can compromise the integrity of Au on Al bonds.
Aluminum Bonding Wires Market contains market size and forecasts of Aluminum Bonding Wires in global, including the following market information:
Global Aluminum Bonding Wires Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Aluminum Bonding Wires Market Sales, 2017-2022, 2023-2028, (K Km)
Global top five Aluminum Bonding Wires companies in 2021 (%)
The global Aluminum Bonding Wires market was valued at 168.7 million in 2021 and is projected to reach US$ 254.2 million by 2028, at a CAGR of 6.0% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Small Diameter Aluminum Wires Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Aluminum Bonding Wires include Heraeus, Tanaka, Custom Chip Connections, World Star Electronic Material Co.,Ltd., Ametek, Nichetech, Holdwell and Yantai YesNo Electronic Materials, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Aluminum Bonding Wires manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Aluminum Bonding Wires Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Km)
Global Aluminum Bonding Wires Market Segment Percentages, by Type, 2021 (%)
Small Diameter Aluminum Wires
Large Diameter Aluminum Wires
Global Aluminum Bonding Wires Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Km)
Global Aluminum Bonding Wires Market Segment Percentages, by Application, 2021 (%)
Automotive Electronics
Consumer Electronics
Power Supplies
Computing Equipment
Industrial
Military & Aerospace
Others
Global Aluminum Bonding Wires Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Km)
Global Aluminum Bonding Wires Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Aluminum Bonding Wires revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Aluminum Bonding Wires revenues share in global market, 2021 (%)
Key companies Aluminum Bonding Wires sales in global market, 2017-2022 (Estimated), (K Km)
Key companies Aluminum Bonding Wires sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Heraeus
Tanaka
Custom Chip Connections
World Star Electronic Material Co.,Ltd.
Ametek
Nichetech
Holdwell
Yantai YesNo Electronic Materials