Adhesives for Electronics Assembly Market

Electronic adhesives are?made from the raw material such as epoxies, silicones, cyanoacrylates, polyurethanes, and polysulfides. They are the part of the electronic components, which is utilized in the assembly and manufacture of electronic circuits and products.
Adhesives for Electronics Assembly Market aims to provide a comprehensive presentation of the global market for Adhesives for Electronics Assembly, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Adhesives for Electronics Assembly. Adhesives for Electronics Assembly Market contains market size and forecasts of Adhesives for Electronics Assembly in global, including the following market information:
Global Adhesives for Electronics Assembly Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Adhesives for Electronics Assembly Market Sales, 2018-2023, 2024-2029, (Tons)
Global top five Adhesives for Electronics Assembly companies in 2022 (%)
The global Adhesives for Electronics Assembly market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Liquid Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Adhesives for Electronics Assembly include 3M, Arkema, Parker Hannifin Corporation, H.B. Fuller, DELO Industrial Adhesives, Panacol-Elosol GmbH, ITW, Dow and Huntsman, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Adhesives for Electronics Assembly manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Adhesives for Electronics Assembly Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global Adhesives for Electronics Assembly Market Segment Percentages, by Type, 2022 (%)
Liquid
Paste
Solid
Global Adhesives for Electronics Assembly Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global Adhesives for Electronics Assembly Market Segment Percentages, by Application, 2022 (%)
Consumer Electronics
Industrial
Medical
Transportation
Aviation and Defense
Others
Global Adhesives for Electronics Assembly Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global Adhesives for Electronics Assembly Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Adhesives for Electronics Assembly revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Adhesives for Electronics Assembly revenues share in global market, 2022 (%)
Key companies Adhesives for Electronics Assembly sales in global market, 2018-2023 (Estimated), (Tons)
Key companies Adhesives for Electronics Assembly sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
3M
Arkema
Parker Hannifin Corporation
H.B. Fuller
DELO Industrial Adhesives
Panacol-Elosol GmbH
ITW
Dow
Huntsman
Hexion
Meridian Adhesives Group
Sika Group
Permabond
Dymax
Panasonic Electronic
ALTANA AG
Bondline
Boyd Corporation
Wacker Chemie AG
Rogers Corporation
Momentive
ThreeBond Group
Master Bond
Scapa Industrial
Xiamen Weldbond New Material
Outline of Major Chapters:
Chapter 1: Introduces the definition of Adhesives for Electronics Assembly, market overview.
Chapter 2: Global Adhesives for Electronics Assembly market size in revenue and volume.
Chapter 3: Detailed analysis of Adhesives for Electronics Assembly manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Adhesives for Electronics Assembly in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Adhesives for Electronics Assembly capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.